Invitation to
PACK EXPO 2026
Chicago, USA | October 18 – 21, 2026 |
Booth W-40022
Get the latest update on our
Rotary cutting, creasing, punching and stacking machines at PACK EXPO 2026
Schobertechnologies is pleased to announce its participation at PACK EXPO 2026. Our Team is looking forward to welcoming you at our booth. If you have specific projects, we will be happy to advise you. You are more than welcome to bring along samples, photos, drawings, … If you do not have any specific projects for the moment, we will still be happy to show you our exhibits. We are sure that you will be able to draw ideas for the future.
RSM IML-Twin Spider
Cutting and stacking nested products
Cutting and stacking of blanks with web widths of up to 1,000 mm, format lengths of up to 1,220 mm and processing speeds of up to 100 m/min - is no problem. Additional stations for needling, creasing and embossing are optionally available.
The Varicut platform is ideal for short runs and quick format changes.
FLSM – Film hole punching machine
Narrow web perforation of films, foils, nonwovens, and cardboard
The perfect and economical solution for punching materials for the medical technology and electronics industries.
Other highlights we are showing at PACK EXPO 2026
In addition to the machine, you will gain insights into aggregates and components. We would be happy to advise you on site. Just come to our booth.
